Calibration Mixture Gas 99.9999% High Purity CF4/O2 Gas Mixture in Hydrogen & Argon Balance Semiconductor Plasma Etching

About Product

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This ultra-high purity 99.9999% (6N) Calibration Mixture is a specialized process gas solution engineered specifically for the rigorous demands of Semiconductor Plasma Etching and Advanced Thin-Film processes. By precisely blending Carbon Tetrafluoride (CF4) and Oxygen (O2) within a balanced matrix of Hydrogen (H2) and Argon (Ar), this mixture provides the exact chemical synergy required to control etch selectivity and profile anisotropy in sub-nanometer fabrication. The 6N-grade purity ensures that trace metallic impurities and moisture are virtually non-existent, preventing wafer contamination and significantly enhancing device yield for complex architectures like 3D NAND and FinFET

The inclusion of Argon provides the necessary ion bombardment energy for physical sputtering, while the Hydrogen/Oxygen ratio is meticulously calibrated to tune the polymer passivation layers, ensuring high-aspect-ratio trenches with perfectly vertical sidewalls. Every cylinder is prepared using advanced gravimetric mixing and undergo proprietary internal passivization to guarantee that these reactive components remain stable and do not deviate from the specified concentration over time. Provided with a comprehensive Certificate of Analysis (CoA) and traceable to international standards, this mixture is the ideal choice for R&D labs and high-volume semiconductor Fabs requiring absolute consistency in their plasma chemistry. This "all-in-one" balanced mixture simplifies gas delivery systems by reducing the number of individual gas lines needed, thereby minimizing potential leak points and streamlining the mass flow control (MFC) calibration process

 

About Us

AGEM was established in 2008 as a multinational professional manufacturer and service provider of gas equipment, headquartered in Taiwan, China. With 16 years of dedicated industry expertise, its global footprint, superior manufacturing craftsmanship, and comprehensive product portfolio have solidified its status as a benchmark enterprise in the gas equipment sector. The company adheres to a globalization development strategy, establishing modern production bases in Chinese Mainland, Taiwan, China, and India, forming a production and service network that covers Asia and extends globally. Each base is equipped with intelligent production lines and precision testing equipment, enabling full-process control from raw material processing to finished product delivery. With annual production capacity consistently ranking among industry leaders, the company can swiftly respond to the diverse needs of global clients. The core business focuses on gas-related core equipment, encompassing a full range of products including various industrial gases, specialized gas valves, high-pressure cylinders, lightweight aluminum cylinders, and high-precision pressure reducers. These products are widely applied in critical sectors such as chemicals, electronics, healthcare, and energy. Leveraging profound technical expertise, the products have obtained ISO9001 Quality Management System certification and multiple authoritative international certifications, including ASME certification for high-pressure equipment, CE-PED certification for EU market access, and IECEx explosion-proof certification for global application. Key performance indicators such as sealing performance, pressure resistance, and safety protection have achieved internationally advanced levels. The company consistently prioritizes technological innovation as its core competitive strength, assembling an international R&D team and continuously investing in technological breakthroughs

       

FAQs

What is the lead time for custom 99.9999% (6N) purity mixtures

For ultra-high purity (UHP) gases like CF4/O2, the typical lead time is 10-15 working days. This includes precision blending and multi-stage stability testing to ensure the 6N grade purity and concentration accuracy

How do you guarantee the concentration accuracy of the CF4/O2 mixture

We use the gravimetric method (high-precision weighing) during filling, which is the most accurate blending technique. Each cylinder is analyzed via Gas Chromatography (GC) and comes with a Certificate of Analysis (COA) traceable to NIST or national standards

Is this mixture stable given it contains both Hydrogen H2and Oxygen O2

Yes. We strictly follow safety blending protocols where the concentration of flammable and oxidative components is kept within safe limits or balanced with Argon (Ar) to ensure chemical stability and prevent any hazardous reactions inside the cylinder

What type of cylinder and valve are used for this semiconductor gas

We use internally passivated aluminum alloy cylinders or polished stainless steel cylinders to prevent surface adsorption. For 6N grade gases, we typically equip them with DISS (Digital Intelligent Scheduling System) 660 or SS 316L stainless steel valves to ensure zero leakage and prevent contamination

What are the storage requirements for this gas mixture

Cylinders should be stored in a cool, dry, and well-ventilated area, away from direct sunlight and heat sources (temperature < 50° C Ensure the cylinders are secured upright to prevent falling

Do you provide worldwide shipping for hazardous gases

Yes, we specialize in Class 2 hazardous goods logistics. We provide full documentation including MSDS (Material Safety Data Sheet), UN-certified packaging, and DG (Dangerous Goods) declarations for sea or air freight

AGEM presents the Calibration Mixture Gas 99.9999% High Purity CF4/O2 Gas Mixture in Hydrogen & Argon Balance for Semiconductor Plasma Etching — a precision-engineered, ultra-high-purity gas solution designed to meet the stringent demands of modern semiconductor fabrication and process control. This high-purity calibration gas, formulated for stability and consistency, addresses critical needs across semiconductor plasma etching, analytical calibration, and process verification. AGEM leverages decades of gas manufacturing and RD expertise to ensure that every cylinder delivers reliable performance and traceability for advanced process environments.

Product Overview and Key Features

The AGEM Calibration Mixture 99.9999% combines CF4 O2 gas mixture with controlled concentrations stabilized in hydrogen and argon balance. This high-purity calibration gas is blended and verified to exacting standards to serve as a benchmark for process tools and analytical instrumentation used in semiconductor manufacturing. Each cylinder undergoes rigorous quality control to guarantee the composition and minimize impurities, making it ideal for semiconductor plasma etching gases applications where even parts-per-billion contaminants can affect yields.

- Ultra-high purity composition: The calibration mixture 99.9999% is produced to meet ultra-low impurity levels, ensuring maximum process reproducibility for semiconductor plasma etching gases.

- Precision blending: CF4 O2 gas mixture concentrations are calibrated to exact specifications, with hydrogen and argon balance gases selected to optimize plasma chemistry and analytical compatibility.

- Traceability and certification: Every batch of this high-purity calibration gas is accompanied by detailed certification and analytical documentation, supporting ISO and industry audit requirements.

- Stability and shelf life: The gas formulation and packaging are optimized to maintain long-term stability, preventing concentration drift and ensuring reliable performance over typical storage cycles.

- Customizable concentrations: AGEM offers tailored concentrations of CF4 O2 gas mixture within the hydrogen & argon balance to meet specific tool and process parameter requirements for etching and plasma diagnostics.

Applications and Use Cases

This CF4 O2 gas mixture is specifically designed for semiconductor plasma etching gases use, enabling precise control and calibration across a variety of processes and instruments:

- Semiconductor plasma etching process calibration: The high-purity calibration gas provides accurate reference standards for endpoint detection, process tuning, and chamber matching in reactive-ion etch (RIE), deep reactive-ion etch (DRIE), and other plasma-assisted etch technologies.

- Analytical instrument calibration: Used as a primary or secondary calibration gas for mass spectrometers, residual gas analyzers (RGA), gas chromatographs, and other analytical equipment to ensure accurate detection and quantification of process gases and by-products.

- Leak and purity verification: The calibration mixture 99.9999% supports leak detection protocols and helps confirm gas delivery system integrity for semiconductor Fabs and research labs.

- Process monitoring and fault diagnosis: Integrating this high-purity calibration gas into routine monitoring enables rapid identification of deviations in plasma chemistry and assists in root-cause analysis for process excursions.

- Metrology and R&D: Essential for research laboratories and process development groups working on next-generation etch chemistries, offering consistent reference conditions for reproducible experiments.

Technical Advantages and Innovation

AGEM’s Calibration Mixture Gas 99.9999% delivers several technical advantages rooted in precision manufacturing and research-driven innovation:

- Advanced blending technology: AGEM employs state-of-the-art blending systems and mass-flow-controlled mixing to achieve ultra-precise CF4 O2 gas mixture ratios. This ensures accurate reproducibility from cylinder to cylinder and batch to batch.

- Hydrogen & argon balance optimization: The choice of hydrogen and argon as balance gases provides superior plasma chemistry control and improved analytical signatures. Hydrogen can enhance etch selectivity in certain chemistries, while argon contributes to sputter characteristics and stability during plasma generation.

- Rigorous contamination control: Through controlled manufacturing environments, high-purity raw materials, and multi-tier filtration and purification steps, AGEM minimizes impurities that could otherwise affect sensitive semiconductor plasma etching gases processes.

- Comprehensive validation and QA: Each cylinder is validated using high-resolution analytical methods to verify composition and impurity levels. AGEM’s documentation supports process qualification and regulatory compliance for critical semiconductor applications.

- Scalable production with regional support: AGEM’s RD capabilities and manufacturing footprint support reliable supply across multiple regions, reducing lead times and ensuring consistent availability of this high-purity calibration gas.

Operational Considerations

To realize maximum benefit from AGEM’s CF4 O2 gas mixture for semiconductor plasma etching gases, AGEM recommends the following operational practices:

- Storage and handling: Store cylinders in accordance with provided safety guidelines, maintaining temperature ranges that preserve gas stability. Use proper regulators and gas delivery hardware compatible with CF4 O2 gas mixture and hydrogen/argon blends.

- Cylinder integrity checks: Inspect valves, fittings, and regulators prior to installation. Verify certification labels and batch documentation to ensure traceability.

- Calibration routines: Integrate the calibration mixture 99.9999% into scheduled calibration and verification routines for process tools and analytical equipment to maintain process control and reduce variability.

- Safety and compliance: Follow local regulations and safety protocols for handling fluorinated gases and hydrogen-containing mixtures. AGEM provides Material Safety Data Sheets (MSDS) and handling guidance to support safe usage.

Why Choose AGEM

AGEM’s dedication to product excellence makes the Calibration Mixture Gas 99.9999% a dependable choice for semiconductor fabrication and analytical laboratories. Key reasons to select AGEM’s high-purity calibration gas include:

- Expertise and reliability: AGEM’s deep experience in specialty and calibration gases ensures precise, repeatable CF4 O2 gas mixture formulations tailored for semiconductor plasma etching gases.

- Quality assurance: Stringent QC processes, full traceability, and certified analytical results back every cylinder, supporting process qualification and audit readiness.

- Research-driven development: Ongoing RD investments allow AGEM to refine blending technologies and adapt formulations to evolving etch process requirements.

- Global support: Operational presence across six regions assures responsive supply and technical assistance for process integration and trouble-shooting.

AGEM’s Calibration Mixture Gas 99.9999% High Purity CF4/O2 Gas Mixture in Hydrogen & Argon Balance offers a high-performance solution for semiconductor plasma etching gases challenges. Combining ultra-high purity, precise CF4 O2 gas mixture ratios, and robust quality assurance, this high-purity calibration gas supports accurate calibration, reliable process control, and improved yield outcomes in advanced semiconductor manufacturing. With AGEM’s proven manufacturing and RD capabilities, customers receive a traceable, stable, and customizable calibration mixture 99.9999% tailored to the most demanding semiconductor processes.